The objectives of this research were to design and demonstrate a new class of ultra-low parasitics, 3D power module for EV/HEV applications with high dv/dt capability, and enhanced thermal management. In order to address the challenges associated with SiC power module packaging technologies including, switching waveform distortion (overshoot and resonance) by parasitic inductance, high-level of noise generated from increased dv/dt and parasitic capacitance, and high-thermal densities that could potentially aggravate package reliability, a leadframe-based 3D stacked power module design was introduced and demonstrated. This unique approach is highly modular and compatible with current and future manufacturing infrastructures and processes, making it a suitable manufacturing process for low-cost, high-volume mass production, and yielding a compact 3D stacked package.
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MATIN Development Team