The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, highperformance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin lowwarpage and low die-shift GPE packages were first time demonstrated with thickness less than 150 mm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.2 dB at 77 GHz enabled by ultra-low loss RDL dielectric, and optimized high precision processes for via drilling and photolithography with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for highfrequency characterization of ultra-thin GPE package for mm-Wave applications. GPE packages with low system insertion loss (-0.6 dB @ 77 GHz) & low noise figure (2.9 dB @ 77 GHz) were demonstrated, enabled by chip-package co-design and GPE architecture.
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MATIN Development Team