Modeling, Design, Fabrication and Demonstration of Ultra-Thin, High- Performance Glass Panel Embedded (Gpe) Packages for Mm-Wave Applications

By Shi, Tailong

Georgia Institute of Technology

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Abstract

Advisors: Rao R. Tummala, Madhavan Swaminathan, Andrew F. Peterson, Mohanalingam Kathaperumal, Eric Vogel

The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, highperformance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin lowwarpage and low die-shift GPE packages were first time demonstrated with thickness less than 150 mm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.2 dB at 77 GHz enabled by ultra-low loss RDL dielectric, and optimized high precision processes for via drilling and photolithography with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for highfrequency characterization of ultra-thin GPE package for mm-Wave applications. GPE packages with low system insertion loss (-0.6 dB @ 77 GHz) & low noise figure (2.9 dB @ 77 GHz) were demonstrated, enabled by chip-package co-design and GPE architecture.

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Researchers should cite this work as follows:

  • Shi, Tailong (2021), "Modeling, Design, Fabrication and Demonstration of Ultra-Thin, High- Performance Glass Panel Embedded (Gpe) Packages for Mm-Wave Applications," https://matin.gatech.edu/resources/4041.

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MATIN Development Team

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