Simultaneous Input and State Estimation Through a Unifying MMSE Framework With Applications in Structural Dynamics
11 Jan 2021 | Contributor(s):: Liu, Xi
Advisors: Yang Wang, Erik I. Verriest, Rafi L. Muhanna, Lauren K. Stewart, Donald W. WhiteThis research investigates simultaneous input-state estimation for stochastic linear systems in the presence of unknown input or disturbance. When prior knowledge of the unknown input is not available, an...
Structural Impacts of Inflatable Aerodynamic Decelerator Design
08 Sep 2020 | Contributor(s):: Li, Lin
Advisors: Julian Rimoli, Robert Braun, Graeme Kennedy, John Dec, Neil CheatwoodIn order to land larger payloads to Mars, more capable decelerators are required to advance beyond the performance limitations of traditional heritage entry, descent, and landing technologies. One potential technology...
Smart Finite Elements: An Application of Machine Learning to Reduced-Order Modeling of Multi-Scale Problems
21 Aug 2019 | Contributor(s):: Capuano, German
Advisors: Julian J. Rimoli, Arash Yavari, Evangelos Theodorou, Massimo Ruzzene, Claudio V. Di LeoTo design structures using state-of-the-art materials like composites and metamaterials, we need predictive tools that are capable of taking into account the phenomena occurring at different length...
Experimental and Theoretical Assessment of Thin Glass Panels as Interposers for Microelectronic Packages
22 May 2014 | Contributor(s):: McCann, Scott R.
Advisors: Suresh K. Sitaraman, Rao R. Tummala, Yogendra JoshiAs the microelectronic industry moves toward stacking of dies to achieve greater performance and smaller footprint, there are several reliability concerns when assembling the stacked dies on current organic substrates. These concerns...
Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages
13 Jan 2014 | Contributor(s):: Liu, Xi
Advisors: Suresh K. Sitaraman, Samuel Graham, Olivier N. Pierron, Rao R. Tummala, Sung Kyu LimWith continued push toward 3D integrated packaging, Through-Silicon Vias (TSVs) play an increasingly important role in interconnecting stacked silicon dies. Although progress is being made in the...