Tags: Glass interposers

Theses and Dissertations (1-2 of 2)

  1. Electrical Modeling, Design and Characterization of Tapered Through-Package-Vias in Glass Interposers for High-Performance Applications

    11 Jan 2017 | Contributor(s):: Tong, Jialing

    Advisors: Rao R. Tummala, Andrew F. Peterson, Oliver Brand, Suresh K. Sitaraman, Venkatesh SundaramThree dimensional (3D) packaging technologies are being developed to address the escalating demand for data traffic at lowest power consumption, smallest form factors, and lowest cost. Glass has...

  2. Integration of Optoelectronics Interconnects on Glass Interposers for High Speed Communications

    11 Jan 2021 | Contributor(s):: Zhang, Rui

    Advisors: Rao R. Tummala, Gee-Kung Chang, Muhannad S. Bakir, Eric M. Vogel, Mohanalingam KathaperumalThe development and application of artificial intelligence and augmented reality as well as billions of new devices connected to the network have resulted in unprecedented demands on high...