Tags: Packaging

Resources (1-2 of 2)

  1. Design and Demonstration of High-Performance Ultra-Thin Antenna-Integrated 3D Glass-Based Mm-Wave Packages

    11 Jan 2021 | Contributor(s):: Watanabe, Atom O.

    Advisors: Rao R. Tummala, Madhavan Swaminathan, Andrew Peterson, Hua Wang, Pulugurtha M. RajThe fast-growing 5G wireless communications are emerging to transform a range of consumer and industrial sectors. Package integration of mm-wave components with antenna-in-package is one of the key...

  2. Advances in Panel Glass Packaging of Mems and Sensors for Low Stress and Near Hermetic Reliability

    29 May 2019 | Contributor(s):: Buch, Chintan

    Advisors: Rao R TummalaMEMS based sensing is gaining widespread adoption in consumer electronics as well as the next generation Internet of Things (IoT) market. Such applications serve as primary drivers towards miniaturization for increased component density, multi-chip integration, lower cost...